Methods of manufacturing a hidden antenna in an encasing of a handheld device

ABSTRACT

The disclosed techniques include a method of integrating antenna elements separated by concealed antenna breaks with an encasing. The method can include forming a continuous non-conductive coating on a conductive substrate. The continuous non-conductive coating has sufficient thickness and hardness to remain intact when gaps are etched in the conductive substrate to form separate conductive regions. The method also includes etching the gaps in the conductive substrate to form the conductive regions on the continuous non-conductive coating, and backfilling the gaps with a non-conductive substance such that the conductive regions, the non-conductive substance separating the conductive regions, and the continuous non-conductive coating collectively form a continuous encasing.

CROSS REFERENCE TO RELATED APPLICATIONS

This application is a divisional of U.S. patent application Ser. No.15/336,686, filed Oct. 27, 2016, which claims priority to U.S.provisional patent application Ser. No. 62/317,466 filed Apr. 1, 2016,U.S. provisional patent application Ser. No. 62/249,130 filed Oct. 30,2015, and U.S. provisional patent application Ser. No. 62/300,631 filedFeb. 26, 2016, which are all incorporated herein in their entireties bythis reference.

TECHNICAL FIELD

The disclosed teachings relate to antennas. More particularly, thedisclosed teachings relate to antennas for handheld devices.

BACKGROUND

Antennas for handheld devices (e.g., smartphones) are relatively complexstructures. Modern antenna designs are limited by physical andfunctional constraints due to the small sizes of handheld devices andfunctional restrictions imposed by carriers and regulatory agencies.Moreover, a handheld device typically must accommodate numerousantennas, such as a primary cellular antenna, a diversity cellularantenna, a global positioning system (GPS) antenna, a Wi-Fi antenna, anear field communication (NFC) antenna, and the like.

For example, the primary antenna of a smartphone is typically the onlycellular antenna that transmits signals. The primary antenna is designedto support specific frequencies, and comply with a limited specificabsorption rate (SAR) of energy that can be absorbed by human tissue anda total radiated power (TRP) for every frequency band that the handhelddevice supports. These constraints, along with the type of antenna, andnumber of other antennas, typically dictate the location of an antennaon a handheld device. For example, the location of a primary antenna isusually at the lower end of a handheld device to comply with SARlimitations.

Dipole antennas are commonly used in smartphones. A dipole antenna hastwo conductive elements, such as metal wires or rods, that are usuallybilaterally symmetrical. The dipole antenna is electrically coupled tocommunications circuitry such as transmitter and/or receiver circuitry.In operation, a driving current from the transmitter is applied or, forreceiving antennas, an output signal to the receiver is taken, betweenthe two conductive elements of the antenna.

A dipole antenna is physically about a half-wavelength long to providereasonable efficiency and bandwidth. The overall size of the antenna isdetermined by the lowest frequency of operation because it has thelongest wavelength. For example, supporting a low-band of around 810 MHzrequires a handheld device to be about 7 inches long. As a result, anantenna may use an entire structure of a mobile phone, which is about 5to 7 inches long.

FIG. 1 is a schematic diagram that shows the evolution of a simpledipole antenna into a typical dipole antenna for cellular phones. FIG.1(a) shows a six-inch center fed dipole that includes two bilaterallysymmetrical conductive elements 10-1 and 10-2. FIG. 1(b) shows anon-center fed dipole antenna with one fat arm 10-4. The fat arm 10-4could make up the chassis for a mobile phone and function as a groundplane of the antenna to serve as a reflecting surface for radio waves.In FIG. 1(c), a top arm 10-5 is meandered to increase the length of thedipole antenna, and from there the antenna can evolve into an inverted-Fantenna that is commonly used in wireless communications.

FIG. 2A shows an antenna formed by an encasing of a handheld device 12.As shown, the encasing is formed of three conductive elements 14-1,14-2, and 14-3 separated by gaps 16-1 and 16-2 including non-conductivematerial. Examples of conductive material include aluminum and titanium.Examples of non-conductive material include various ceramics. FIG. 2B isa functional representation of the antenna 18 formed by the encasing ofhandheld device 12. The antenna 18 includes two antenna elements 20-1and 20-2 corresponding to the physical conductive elements 14-1 and14-2, respectively.

The gaps 16-1 and 16-2 that physically separate the conductive elements14-1, 14-2, and 14-3 are commonly referred to as “antenna breaks.” Theseparation formed by gap 16-1 enables the antenna 18 of handheld device12 to radiate. This antenna design is difficult to implement becausehaving that much metal on the backside of the handheld device 12introduces parasitic capacitance that does not radiate. Moreover, theantenna breaks 16-1 and 16-2 are aesthetically unpleasing. Thus, currentantenna designs for handheld devices have presented several challengesand are limited as a result of functional and physical constraints.

SUMMARY

Introduced here are at least one apparatus and one method. The at leastone apparatus includes a handheld device having antenna elementsintegrated with an encasing and/or appurtenances of the handheld device.The at least one method is a method of integrating antenna elementsseparated by concealed antenna breaks into an encasing of the handhelddevice.

In some embodiments, a handheld device can include an encasing, one ormore appurtenances associated with the encasing, communicationscircuitry contained within the encasing, and antenna elements. Theantenna elements can be electrically coupled to the communicationscircuitry and integrated with the encasing and the one or moreappurtenances. The appurtenances can include any of a touch-sensitivedisplay screen, a button, a joystick, a click wheel, a scrolling wheel,a touchpad, a keypad, a keyboard, a microphone, a speaker, a camera, asensor, a light-emitting diode, a data port, or a power port.

In some embodiments, a handheld device can include an encasing,communications circuitry contained within the encasing, and a displayscreen associated with the encasing. The display screen can include alight emitting panel, a transparent panel, and an antenna panel disposedbetween the light emitting panel and the transparent panel. The antennapanel can include at least one antenna element electrically coupled tothe communications circuitry. The antenna element can be at leastsemitransparent to light emitted from the light emitting panel.

In some embodiments, methods of integrating antenna elements separatedby concealed antenna breaks with an encasing include forming acontinuous non-conductive coating on a conductive substrate. Thecontinuous non-conductive coating has sufficient thickness and hardnessto remain intact when gaps are etched in the conductive substrate toform separate conductive regions. The methods include etching the gapsin the conductive substrate to form the conductive regions on thecontinuous non-conductive coating. The methods further includebackfilling the gaps with a non-conductive substance such that theconductive regions, the non-conductive substance separating theconductive regions, and the continuous non-conductive coatingcollectively form a continuous encasing.

Other aspects of the disclosed embodiments will be apparent from theaccompanying figures and detailed description.

This Summary is provided to introduce a selection of concepts in asimplified form that are further described below in the DetailedDescription. This Summary is not intended to identify key features oressential features of the embodied subject matter, nor is it intended tobe used to limit the scope of the embodied subject matter.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic diagram that shows the evolution of a simpledipole antenna into a typical dipole antenna for cellular phones;

FIG. 2A shows an antenna formed by an encasing of a handheld device;

FIG. 2B is a functional representation of the antenna formed by theencasing of the handheld device of FIG. 2A;

FIG. 3A shows antenna elements separated by irregularly shaped antennabreaks that are collectively integrated with an encasing of a handhelddevice;

FIG. 3B is a functional representation of an antenna formed by theencasing of the handheld device of FIG. 3A;

FIG. 3C shows a cutaway profile view of a portion of the handheld deviceof FIG. 3A;

FIG. 4A shows antenna elements integrated with both an encasing and anappurtenance of a handheld device;

FIG. 4B illustrates a functional representation of an antennacollectively formed by a combination of an encasing and an appurtenanceof the handheld device;

FIG. 4C is a cutaway profile view of a portion of the handheld device ofFIG. 4A;

FIG. 5A shows antenna elements integrated with an appurtenance of ahandheld device;

FIG. 5B illustrates a functional representation of an antenna formed bythe appurtenance of FIG. 5A;

FIG. 5C is a cutaway profile view of a portion of the handheld device ofFIG. 5A;

FIG. 6A shows an antenna element integrated with a display screen of ahandheld device;

FIG. 6B shows layers of a display screen that incorporates an antennawith the display screen of the handheld device;

FIG. 6C shows layers of the backside of a handheld device thatincorporates an antenna with the backside of the handheld device;

FIG. 7A shows antenna elements separated by a concealed antenna breakintegrated with an encasing of a handheld device;

FIG. 7B is a functional representation of an antenna formed by theencasing of the handheld device of FIG. 7A;

FIG. 7C is a cutaway profile view of a portion of the handheld device ofFIG. 7A;

FIG. 8 illustrates a method of using electrochemical surface treatmentprocesses to integrate antenna elements separated by concealed antennabreaks with an encasing for a handheld device;

FIG. 9 illustrates a method of using a spraying process to integrateantenna elements separated by concealed antenna breaks with an encasingfor a handheld device according to one embodiment; and

FIG. 10 illustrates a method of using a spraying process to integrateantenna elements separated by concealed antenna breaks with an encasingfor a handheld device according to another embodiment.

DETAILED DESCRIPTION

The embodiments set forth below represent the necessary information toenable those skilled in the art to practice the embodiments, andillustrate the best mode of practicing the embodiments. Upon reading thefollowing description in light of the accompanying figures, thoseskilled in the art will understand the concepts of the disclosure andwill recognize applications of these concepts that are not particularlyaddressed here. It should be understood that these concepts andapplications fall within the scope of the disclosure and theaccompanying claims.

The purpose of terminology used here is only for describing embodimentsand is not intended to limit the scope of the disclosure. Where contextpermits, words using the singular or plural form may also include theplural or singular form, respectively.

As used herein, the term “handheld device” refers to a small mobilecomputing device. Examples include a mobile phone, tablet computer,wearable computer, or the like.

As used herein, the term “integrating with” and variations thereof referto structurally combining elements with one another.

As used herein, the term “antenna element” refers to a conductiveelement of an antenna that transmits or receives signals. For example,the conductive elements of a dipole antenna are antenna elements.

As used herein, the term “antenna break” refers to a gap or separationbetween antenna elements of an antenna. The antenna break is usuallyformed of non-conductive material.

As used herein, the term “communications circuitry” refers to thevarious electronics circuitry included in a handheld device thatcontrols the operations of an antenna to, for example, transmit orreceive signals such as radio frequency signals.

As used herein, unless specifically stated otherwise, terms such as“processing,” “computing,” “calculating,” “determining,” “displaying,”“generating” or the like, refer to actions and processes of a computeror similar electronic computing device that manipulates and transformsdata represented as physical (electronic) quantities within thecomputer's memory or registers into other data similarly represented asphysical quantities within the computer's memory, registers, or othersuch storage medium, transmission, or display devices.

As used herein, the terms “connected,” “coupled,” or variants thereof,refer to any connection or coupling, either direct or indirect, betweentwo or more elements. The coupling or connection between the elementscan be physical, logical, or a combination thereof.

Disclosed here is at least one handheld device integrating one or moreantenna elements with components of the handheld device. The componentsinclude physical structures such as an encasing that forms an exteriorsurface of the handheld device and appurtenances of the handheld devicethat receive inputs or supply outputs. The antenna elements are formedof a conductive material suitable to radiate and receive radio signals.The antenna elements may be formed in a variety of shapes to accommodateintegration into an encasing or appurtenances. Further, the antennaelements may be formed of a transparent or semitransparent material.Moreover, antenna breaks that separate the antenna elements may beconcealed or irregularly shaped. As a result, an antenna is integratedwith a combination of components of a handheld device to improveaesthetics and efficiently utilize existing physical structures.

Embodiments include a smartphone antenna that addresses the issue ofefficient radiation while eliminating various compromises found inexisting smartphones. In some embodiments, external components of asmartphone are used as antennas. For example, antenna elements caninclude any of a smartphone's side keys, camera bump/island, etc. Insuch embodiments, the camera bezel, volume key, and the like can beused, alone or in combination, as an antenna. Other embodiments includetransparent antennas formed on a smartphone display screen, over thedisplay screen itself, and under the display glass. In such embodiments,the display screen is an antenna radiator, for example, constituting atransparent conductor printed on the backside of the display screen.Embodiments also provide non-linear antenna breaks and/orvariable-thickness antenna breaks.

FIG. 3A shows antenna elements separated by an irregularly shapedantenna break that are collectively integrated with an encasing of ahandheld device. The encasing of the handheld device 22 houseselectronics and circuitry, such as communication circuitry to processwireless communications. The encasing has a front that may include adisplay screen (not shown). The back of the encasing has a surface thatincludes a camera lens 24 of a backside camera disposed on a centralvertical axis of the handheld device 22. The backside surface alsoincludes a light source 26 that may indicate a status or provide a flashfor the camera.

The back of the encasing is formed of conductive elements 28-1 and 28-2separated by a gap 30 formed of non-conductive material. The conductiveelements 28-1 and 28-2 may be formed of any conductive material such asaluminum or titanium. The gap 30 may be formed of any non-conductivematerial such as ceramic. The conductive elements 28-1 and 28-2 areelectrically coupled to the communications circuitry housed within theencasing of the handheld device 22. As a result, the conductive elements28-1 and 28-2 can act as antenna elements for wireless communications ofthe handheld device 22.

The gap 30 separating the conductive elements 28-1 and 28-2 isirregularly shaped. As used here, the term “irregularly shaped” andvariants thereof refer to an elongated shape that is not continuouslylinear along a plane. For example, an irregularly shaped gap may benon-linear or have variable thickness along a plane, or a combination ofboth. As shown, the irregularly shaped gap 30 extends across the back ofthe encasing. The irregularly shaped gap 30 includes both linear andnon-linear portions along the same plane. In particular, the irregularlyshaped gap 30 includes a portion that curves with the camera lens 24 ofthe handheld device 22.

FIG. 3B is a functional representation of an antenna 32 formed by theencasing of the handheld device 22 of FIG. 3A. The antenna 32 is formedof antenna elements 34-1 and 34-2 separated by an irregularly shapedantenna break 36. The antenna elements 34-1 and 34-2 correspond to theconductive elements 28-1 and 28-2, and the irregularly shaped antennabreak 36 corresponds to the irregularly shaped gap 30. As such, theantenna 32 is integrated with the encasing of the handheld device 22.

FIG. 3C is a cutaway profile view of a portion of the handheld device 22of FIG. 3A. As shown, the irregularly shaped gap 30 separates thebackside encasing into the conductive elements 28-1 and 28-2. The bottomelement includes the camera lens 24 and the light source 26.

Embodiments of a handheld device with irregularly shaped antenna breaksare not limited to that shown in FIGS. 3A through 3C. In someembodiments, any physical dimension of an antenna break may be irregular(e.g., non-uniform). For example, the width or thickness of an antennabreak can vary along the length of the antenna break. As such, one ormore antennas can be integrated with an encasing of a handheld device,while avoiding the need for regularly shaped external dividing antennabreaks to separate the antenna elements.

In some embodiments, antenna elements are integrated with appurtenancesof a handheld device. As referred to herein, an appurtenance is aphysical component associated with an encasing of a handheld device butmay be structurally independent of the encasing. An appurtenance maycontrol the handheld device, may be controlled by the handheld device,or both. For example, a user of a handheld device can supply inputcommands through an appurtenance, view output through an appurtenance,or both. In particular, a user can supply commands to control a handhelddevice by pressing a physical button located on the handheld device.Also, a light emitting diode (LED) of the handheld device may indicate astatus of the handheld device. Other examples of appurtenances includedisplay screens, joysticks, click wheels, scrolling wheels, touch pads,keyboards, microphones, speakers, cameras, sensors, other statusindicators, data ports, power ports, and any other input or outputdevices.

An appurtenance may include conductive components and non-conductivecomponents configured to perform customary functions of the appurtenance(e.g., receive input or provide output). For example, a wheel used foradjusting the volume of a mobile phone may be formed of aluminum andceramic components. In some embodiments, an antenna element may beintegrated with an appurtenance by utilizing these conductive ornon-conductive components. For example, a conductive component of anappurtenance may be electrically coupled to communications circuitrycontained in the mobile phone such that the conductive element of theappurtenance can act as an antenna element.

In some embodiments, an appurtenance may be specifically configured toinclude conductive or non-conductive materials that form antennaelements. For example, an appurtenance may be configured to includeconductive material that acts as an active antenna element whenelectrically coupled to the communications circuitry contained in ahandheld device. As a result, an appurtenance can function as an antennaelement in addition to providing customary input or outputfunctionality.

In some embodiments, antenna elements may be integrated with bothappurtenances and an encasing of a handheld device. As such, differentphysical surfaces, structures, and combinations of both, could act asantenna elements when electrically coupled to communications circuitrycontained in the handheld device to collectively form an antenna of thehandheld device.

FIG. 4A shows antenna elements integrated with both an appurtenance andan encasing of a handheld device. A handheld device 38 includesappurtenances such as a physical button 40, a backside camera 42, and alight source 44. The backside camera 42 includes a lens 46 and a bezel48 that holds the lens 46 in position on the back of the handheld device38. The bezel 48 is formed of conductive material such as aluminum ortitanium, and is electrically coupled to communications circuitrycontained in the handheld device 38.

An encasing 50 of the handheld device 38 is also formed of conductivematerial such as aluminum or titanium, and is also electrically coupledto the communications circuitry contained in the handheld device 38. Aring 52 of non-conductive material is disposed between the bezel 48 andthe encasing 50. As such, the ring 52 is irregularly shaped andseparates the bezel 48 and the encasing 50 of the handheld device 38.

FIG. 4B illustrates a functional representation of an antenna 54collectively formed by a combination of the encasing 50 and the bezel 48of the handheld device 38. The antenna 54 is formed of antenna elements56-1 and 56-2 separated by an irregularly shaped antenna break 58. Theantenna elements 56-1 and 56-2 correspond to the bezel 48 and theencasing 50, respectively, and the irregularly shaped antenna break 58corresponds to the ring 52. As such, the antenna 54 is integrated withboth an appurtenance (the backside camera 42) and the encasing 50 of thehandheld device 38.

FIG. 4C is a cutaway profile view of a portion of the handheld device 38of FIG. 4A. As shown, the bezel 48 abuts the lens 46 and can hold thelens 46 in place. The ring 52 (antenna break 58) separates the bezel 48(antenna element 56-1) and the encasing 50 (antenna element 56-2) suchthat their combination can collectively act as the antenna 54 of thehandheld device 38. Accordingly, antenna elements can be integrated withboth an appurtenance and an encasing to better utilize existing physicalstructures of a handheld device.

FIG. 5A shows antenna elements integrated with an appurtenance of ahandheld device. A handheld device 60 includes appurtenances such as aphysical button 62, a backside camera 64, and a light source 66. Thebackside camera 64 includes a lens 68 and a bezel that holds the lens 68in position on the back of the handheld device 60. The bezel includesthree rings of material. An outermost ring 70 and an innermost ring 72are formed of conductive material such as aluminum or titanium. A centerring 74 disposed between the outermost and innermost rings is formed ofnon-conductive material such as ceramic. The conductive rings 70 and 72are electrically coupled to communications circuitry contained withinthe handheld device 60.

FIG. 5B illustrates a functional representation of an antenna 76 formedby the camera bezel of FIG. 5A. The antenna 76 includes ring-shapedantenna elements 78-1 and 78-2 that are separated by an irregularlyshaped antenna break 80. The antenna elements 78-1 and 78-2 correspondto the outermost ring 70 and the innermost ring 72, respectively, andthe irregularly shaped antenna break 80 corresponds to the center ring74. As such, the antenna 76 is integrated with an appurtenance (thebackside camera 64) of the handheld device 60.

FIG. 5C is a cutaway profile view of a portion of the handheld device 60of FIG. 5A. As shown, the lens 68 is held in position on the back of thehandheld device 60 by the bezel including rings 70, 72, and 74. Thecenter ring 74 (irregularly shaped antenna break 80) separates theoutermost ring 70 (antenna element 78-1) and the innermost ring 72(antenna element 78-2) such that their combination can collectively actas the antenna 76 of the handheld device 60. Accordingly, antennaelements can be integrated with an appurtenance to provide additionalfunctionality.

In some embodiments, antenna elements are integrated with anappurtenance such as a display screen of a handheld device. For example,antenna elements may be integrated with a touch-sensitive display screenof a mobile phone. In contrast to other appurtenances, a display screenrenders images as displayed output and may also operate to allow touchcommands on the handheld device.

To avoid obscuring images rendered on the display screen, the antennaelements are formed of conductive material that is at leastsemitransparent to light emitted from the display screen, but preferablytransparent to the emitted light. For example, the antenna elementscould be formed of indium tin oxide (ITO) or other materials that havesuitable conductive properties while remaining at least semitransparentto light emitted from the display screen.

FIG. 6A shows an antenna element 86 integrated with a display screen 82of a handheld device 84. The display screen 82 renders images and mayaccept input commands (e.g., touch inputs). An antenna element 86 isprinted in the display screen 82 and, as such, overlays images renderedon the display screen 82. The antenna element 86 is at leastsemitransparent to light emitted from the display screen 82. As aresult, the display screen 82 acts as an antenna yet the antenna element86 is not visually perceptible by a user viewing images rendered on thedisplay screen 82.

FIG. 6B shows layers of the display screen 82 of FIG. 6A integrated withthe antenna element 86. The display screen 82 includes three panels(e.g., layers). A light emitting panel 88 includes electronics andcircuitry to render images of the display screen. For example, the lightemitting panel 88 may include a thin-film-transistor liquid-crystaldisplay (TFT LCD). The antenna element 86 may be printed on an antennapanel 90, disposed between the light emitting panel 88 and a transparentpanel 92. The transparent panel 92 may be formed of glass or any othersuitable material (e.g., plastic) that is durable to protect the displayscreen 82 while being transparent to light emitted from the lightemitting panel 88.

The antenna panel 90 may be a transparent substrate for the antennaelement 86. The antenna panel 90 may be formed of glass, plastic, orother suitable non-conductive material. The antenna element 86 may beformed on the substrate by a variety of methods. For example, antennaelements could be sprayed, grown, or printed on the antenna panel 90 inaccordance with various techniques known to persons skilled in the art,and described in greater detail further below with respect to otherembodiments. The antenna element 86 is formed of conductive materialthat is at least semitransparent to light emitted from the lightemitting panel 88. As such, the antenna element 86 does not obscurelight emitted from the display screen 82.

The light emitting panel 88, antenna panel 90, and transparent panel 92could be press-fit together and glued to form a front portion of thehandheld device 84. The antenna element 86 is electrically coupled tocommunications circuitry of the handheld device 84 such that the displayscreen 82 acts as an antenna in addition to displaying rendered imagesand optionally receiving input commands.

The types, number, and combination of layers and antenna elementsincluded in a display screen are not limited to that shown in FIG. 6B.In some embodiments, a display screen may include fewer layers. Forexample, antenna elements could be incorporated into the backside of aprotective panel to avoid using a separate antenna panel. In someembodiments, a display screen may include a greater number of layers.For example, a touch-sensitive display screen may include atouch-sensitive panel disposed between the light emitting panel and theprotective panel. The touch-sensitive panel may include conductivedriving lines and sensing lines interweaved with insulating materialthat collectively act to detect touch inputs.

In some embodiments, conductive elements of a display screen that areconfigured to perform touch or image rendering functions can also act asantenna elements. For example, antenna elements can be integrated with atouch-sensitive panel configured to receive touch inputs, or integratedwith a light emitting panel configured to render images.

Hence, existing conductive elements of a display screen can also act asantenna elements. For example, the driving lines and/or sensing lines ofa touch-sensitive panel could have a dual function of providing atouch-sensitive interface and acting as antenna elements. Also,conductive elements configured to control pixels of a display screenconfigured to render images could also have a dual function to act asantenna elements. For example, capacitive coupling could be utilized tocoordinate conductive components of the display screen to render imagesduring some period of time and act as antenna elements during anotherperiod of time.

In some embodiments, the handheld device may automatically enable ordisable the antenna elements integrated in the encasing and/orappurtenances at different times. For example, antenna elementsintegrated with a display screen of a mobile phone may be automaticallydisabled while a user of the mobile phone is conducting a call. Duringthe call, antenna elements integrated in the encasing may remain orbecome enabled. In some embodiments, the antenna elements integrated inthe display screen may only be enabled while the display screen is beingused as an interface to provide inputs or receive outputs, or at alltimes other than when the mobile phone is used for conducting a call, orany combinations thereof in accordance with a multiplexing scheme orwhich could be set as modes of the handheld device.

Embodiments utilizing antenna elements that are at least semitransparentare not limited to display screens. FIG. 6C shows a semitransparent ortransparent antenna element 94 integrated with an encasing of a handhelddevice 96. In particular, the encasing may include an antenna panel 98and a glass panel 100 that forms an outer surface of handheld device 96.The antenna panel 98 is disposed under the glass panel 100, betweenenclosed electronics and circuitry 102 and the glass panel 100. Theglass panel 100 may be decorative and/or functional to protect theenclosed electronics and circuitry 102 and/or accept inputs.

The antenna panel 98 may be the same or similar to the antenna panel 90used in the display screen 84. The antenna element 94 included in theantenna panel 98 can be formed of conductive material that is at leastsemitransparent to visible light. As such, the antenna element 94 is notvisibly perceptible to a user of the handheld device 96. In someembodiments, the antenna element 94 may be integrated directly in theglass panel 100 to avoid requiring the separate antenna panel 98. Theantenna panel 98 and glass panel 100 could be press-fit together andglued to the base of the handheld device 96. The antenna element 94 iselectrically coupled to communications circuitry contained in thehandheld device 96 such that the glass encasing acts as an antenna.

In some embodiments, antenna elements integrated with an encasing of ahandheld device are separated by concealed antenna breaks. As referredto here, a “concealed” antenna break is not visible on an exteriorsurface of an encasing. Instead, the encasing has a continuous exteriorsurface which masks antenna elements and antenna breaks on an interiorof the encasing.

In some embodiments, an encasing integrated with antenna elementsseparated by concealed antenna breaks is formed of multiple layers. Forexample, the encasing may include a continuous layer of non-conductivematerial that forms the external surface of the encasing. The encasingmay also include a contiguous layer of conductive material separated bynon-conductive material, which is hidden by the external continuouslayer of non-conductive material. In this embodiment, the conductivematerial separated by non-conductive material forms the antenna elementsseparated by antenna breaks.

FIG. 7A shows antenna elements separated by a concealed antenna breakintegrated with an encasing of a handheld device. The back of a handhelddevice 104 includes an encasing 106 with a continuous surface. Thehandheld device 104 includes appurtenances such as a backside camera108, a light source 110, and a physical button 112. These appurtenancesmay be incorporated in the continuous surface of the encasing 106. Theencasing 106 includes antenna elements separated by antenna breaks thatare hidden from the outside of the handheld device 104. Thus, theencasing 106 appears uniform because it has a continuous exteriorsurface.

FIG. 7B is a functional representation of the antenna 114 formed by theencasing 106 of the handheld device 104 of FIG. 7A. An outer layer ofthe encasing 106 is RF transparent to an inner layer that includesantenna elements 116-1 and 116-2 separated by a concealed antenna break118. As such, the enclosure of the handheld device 104 is an antennahaving a continuous exterior surface.

FIG. 7C is a cutaway profile view of a portion of the encasing 106 ofthe handheld device 104 of FIG. 7A. The encasing 106 is composed ofmultiple layers. An outermost continuous layer 120 of non-conductivematerial forms an exterior of the encasing 106. A contiguous layer 122of conductive material separated by the non-conductive region 124 formsan interior of the encasing. Thus, the interior of the encasing 106includes conductive regions 126-1 and 126-2 separated by thenon-conductive region 124 corresponding to the antenna elements 116-1and 116-2 separated by the antenna break 118, respectively.

The outermost continuous layer 120 has sufficient thickness and hardnessto provide structural support to form the encasing 106 and subsequentlyenable RF transparency for the antenna elements 116-1 and 116-2 of thecontiguous layer 122. For example, the contiguous layer 122 may beformed of a metal that is etched to create a gap (e.g., non-conductiveregion 124) that separates the metal into the regions 126-1 and 126-2.The gap could then be backfilled with non-conductive filler. In someembodiments, the non-conductive filler may include an adhesive thatbonds the different regions of the contiguous layer 122 to the outermostcontinuous layer 120 to provide additional structural support for theencasing 106.

As detailed below, the outermost continuous layer 120 has sufficientthickness and hardness to remain structurally intact during the etchingand backfilling processes, and then subsequently enabling RFtransparency. In some embodiments, the outermost continuous layer 120may have a thickness of about two-thirds the thickness of the contiguouslayer 122. For example, FIG. 7C shows the outermost continuous layer 120having a thickness of 200 micrometers and the contiguous surface 122having a thickness of 300 micrometers. The conductive regions 126-1 and126-2 are electrically coupled to communications circuitry of thehandheld device 104 to form the antenna elements 116-1 and 116-2 of theantenna 114. As such, the encasing integrates antenna elements separatedby a concealed antenna break.

FIGS. 8 through 10 illustrate methods of integrating antenna elementsseparated by concealed antenna breaks with an encasing of a handhelddevice. The disclosed methods include processes that form a combinationof conductive and non-conductive regions as a single encasing structure.In some embodiments, the regions are formed of materials grown orsprayed on substrates, then etched and backfilled, or combinationsthereof, to form the single encasing structure having a continuousexterior surface that is RF transparent to support antenna elementsseparated by a concealed antenna break integrated with the encasingstructure.

FIG. 8 illustrates a method 800 of using electrochemical surfacetreatment processes to integrate antenna elements separated by concealedantenna breaks into an encasing for a handheld device. The methodincludes using an electrochemical surface treatment process to grow anon-conductive coat on a conductive substrate. The non-conductive coathas a continuous surface that forms an exterior surface of the encasing.The conductive substrate is etched and backfilled to form antennaelements separated by concealed antenna breaks incorporated into theencasing for the handheld device.

In step 802, a conductive substrate such as a metal layer undergoes aelectrochemical surface treatment process to grow a continuousnon-conductive coat. The electrochemical surface treatment process mayinclude plasma electrolytic oxidation (PEO), which is also known asmicroarc oxidation (MAO). This process can grow an oxide coating onmetals such as aluminum or titanium. The coating can provide electricalinsulation and form a hard and continuous exterior surface on anencasing structure. The coating should be of sufficient thickness toenable etching and backfilling processes of the metal substrate to formantenna elements separated by concealed antenna breaks. For example, acoating on a 300-micrometer-thick metal substrate could be 200micrometers or more.

In step 804, the conductive metal layer undergoes an etching process toform gaps that separate the metal layer into conductive regions on thecontinuous non-conductive layer. In step 806, the gaps are backfilledwith a non-conductive filler that acts as an electrical insulatorbetween the conductive regions. In some embodiments, the filler mayinclude an adhesive that bonds the conductive regions and thenon-conductive layer. As a result, the combination of conductive regionsseparated by non-conductive filler all on a continuous non-conductivesubstrate forms a single encasing structure that integrates antennaelements separated by concealed antenna breaks.

FIGS. 9 and 10 illustrate methods of using spraying processes tointegrate antenna elements separated by concealed antenna breaks into anencasing for a handheld device. The spraying processes include thermalspraying and velocity spraying to produce a layer of material havingsufficient thickness and hardness and with desired electricalproperties. In thermal spraying, a coating is formed on a surface byspraying heated particles that adhere to the surface. In velocityspraying (e.g., gas dynamic cold spraying (GDCS)), a coating is formedon a surface by accelerating particles at supersonic speeds to impactthe surface. During impact with the substrate, the particles undergoplastic deformation and adhere to the surface of the substrate.

Coating materials available for the spaying processes may includemetals, alloys, ceramics, plastics, composites, and the like. In someembodiments, conductive material is sprayed on regions of a continuousconductive substrate to form separate conductive regions. In someembodiments, non-conductive material is sprayed on a conductivesubstrate to form a continuous non-conductive coating. The conductivesubstrate is then etched and backfilled to produce separate conductiveregions. The resulting structure forms antenna elements separated by theconcealed antenna break when electrically coupled to communicationscircuitry of a handheld device.

FIG. 9 illustrates a method 900 of using a spraying process to integrateantenna elements separated by concealed antenna breaks into an encasingfor a handheld device according to another embodiment. In step 902, anon-conductive material is sprayed on a conductive substrate to form acontinuous non-conductive coating that covers the conductive substrate.For example, a ceramic could be sprayed to cover an entire metalsubstrate. The ceramic would form a continuous surface of sufficientthickness and hardness to undergo an etching process of the metalsubstrate. In step 904, the conductive substrate undergoes an etchingprocess to form gaps that separate conductive regions on the continuousnon-conductive coating. In step 906, the gaps are backfilled with anon-conductive filler that acts as an electrical insulator between theconductive regions. In some embodiments, the filler may include anadhesive that bonds the conductive regions and the non-conductivesubstrate. As a result, the combination of conductive regions separatedby non-conductive filler all on a continuous non-conductive substrateforms a single encasing structure that integrates antenna elementsseparated by concealed antenna breaks.

FIG. 10 illustrates a method 1000 of using a spraying process tointegrate antenna elements separated by concealed antenna breaks into anencasing for a handheld device according to one embodiment. In step1002, a conductive material is sprayed on regions of a continuousnon-conductive substrate to form conductive regions on the continuousnon-conductive substrate. The conductive regions are separated by gaps.In step 1004, the gaps are backfilled with a non-conductive filler thatacts as an electrical insulator between the conductive regions. In someembodiments, the filler may include an adhesive that bonds theconductive regions and the non-conductive layer. As a result, thecombination of conductive regions separated by non-conductive filler allon a continuous non-conductive substrate forms a single encasingstructure that integrates antenna elements separated by concealedantenna breaks.

The disclosed methods of integrating antenna elements separated byconcealed antenna breaks into an encasing for a handheld device are notlimited to the examples shown in FIGS. 8 through 10. A person skilled inthe relevant technologies would understand that the steps of thedisclosed methods could be practiced in different orders. In someembodiments, the methods may omit certain steps or include steps knownto persons skilled in the art but not described here for the sake ofbrevity. For example, in some embodiments, non-conductive coatingtechnology could be utilized to conceal antenna breaks.

While the disclosure has been described in terms of several embodiments,those skilled in the art will recognize that the disclosure is notlimited to the embodiments described herein, and can be practiced withmodifications and alterations within the spirit and scope of theinvention. Those skilled in the art will also recognize improvements tothe embodiments of the present disclosure. All such improvements areconsidered within the scope of the concepts disclosed herein and theembodiments that follow. Thus, the description is to be regarded asillustrative instead of limiting.

1. A method of manufacturing an encasing for an electronic device, theencasing including a plurality of antenna elements formed of a pluralityof conductive regions separated by one or more gaps forming one or moreantenna breaks concealed by a non-conductive coating, the methodcomprising: forming a continuous non-conductive coating on a conductivesubstrate, the continuous non-conductive coating having sufficientthickness and hardness to remain intact when one or more gaps are etchedin the conductive substrate to form a plurality of separate conductiveregions; etching the one or more gaps in the conductive substrate toform the plurality of separate conductive regions on the continuousnon-conductive coating; and backfilling the one or more gaps with anon-conductive substance such that the plurality of separate conductiveregions, the non-conductive substance separating the plurality ofseparate conductive regions, and the continuous non-conductive coatingcollectively form a continuous encasing.
 2. The method of claim 1,wherein the non-conductive coating is an oxide coating and theconductive substrate is a metal substrate.
 3. The method of claim 1,wherein forming the continuous non-conductive coating comprises:subjecting the conductive substrate to an electrochemical surfacetreatment process to form the continuous non-conductive coating on theconductive substrate.
 4. The method of claim 3, wherein theelectrochemical surface treatment process is a plasma electrolyticoxidation process.
 5. The method of claim 4, wherein the non-conductivecoating is an oxide coating and the conductive substrate is a metal. 6.The method of claim 1, wherein a ratio of a thickness of the conductivesubstrate to a thickness of the non-conductive coating is 3 to
 2. 7. Themethod of claim 1, wherein the conductive substrate is a metalsubstrate, and the continuous non-conductive coating is an oxide coatinggrown on the metal substrate in accordance with a plasma electrolyticoxidation process.
 8. The method of claim 1, wherein the non-conductivesubstance is an adhesive that bonds the plurality of separate conductiveregions.
 9. The method of claim 1, wherein forming the continuousnon-conductive coating comprises: spraying heated particles ofnon-conductive material that adhere onto a surface of the conductivesubstrate to form the non-conductive coating.
 10. The method of claim 1,wherein forming the continuous non-conductive coating comprises:spraying particles of non-conductive material with sufficient velocitysuch that the particles undergo a deformation and adhere to a surface ofthe conductive substrate to form the non-conductive coating.
 11. Themethod of claim 10, wherein the spraying is gas dynamic cold spraying.12. The method of claim 10, wherein the particles of non-conductivematerial are ceramic particles.
 13. The method of claim 10, wherein theparticles of non-conductive material are plastic particles.
 14. Themethod of claim 1, wherein forming the continuous non-conductive coatingcomprises: spraying particles of non-conductive material with sufficientacceleration and velocity of at least supersonic speed such that theparticles undergo a deformation and adhere to a surface of theconductive substrate to form the non-conductive coating.
 15. A method ofmanufacturing an encasing of a smartphone including a plurality ofantenna elements formed of a plurality of conductive metal regionsseparated by one or more gaps forming one or more antenna concealed by anon-conductive coating, the method comprising: growing a continuousnon-conductive oxide coating on a conductive metal substrate inaccordance with a plasma electrolytic oxidation process, the continuousoxide coating having sufficient thickness and hardness to remain intactwhen one or more gaps are etched in the conductive metal substrate toform a plurality of separate conductive metal regions; etching the oneor more gaps in the conductive metal substrate to form the plurality ofseparate conductive metal regions on the continuous non-conductive oxidecoating; and backfilling the one or more gaps with a non-conductiveadhesive substance such that the conductive metal regions, thenon-conductive adhesive substance separating the plurality of separateconductive metal regions, and the continuous non-conductive oxidecoating collectively form a continuous encasing.
 16. A method ofmanufacturing an encasing for an electronic device, the encasingincluding a plurality of antenna elements formed of a plurality ofconductive regions separated by one or more gaps forming one or moreantenna breaks concealed by a non-conductive coating, the methodcomprising: forming a plurality of conductive regions on a continuousnon-conductive substrate, the plurality of conductive regions beingseparated by one or more gaps; and backfilling the one or more gaps witha non-conductive substance such that the plurality of conductiveregions, the non-conductive substance separating the plurality ofconductive regions, and the continuous non-conductive coatingcollectively form a continuous encasing.
 17. The method of claim 16,wherein the continuous non-conductive substrate is a ceramic substrate.18. The method of claim 16, wherein forming the plurality of conductiveregions comprises: spraying particles of conductive material withsufficient velocity such that the particles undergo a deformation andadhere to a surface of the non-conductive substrate to form theplurality of conductive regions.
 19. The method of claim 16, whereinforming the plurality of conductive regions comprises: spraying heatedparticles of conductive material that adhere onto a surface of thenon-conductive substrate to form the plurality of conductive regions.20. The method of claim 19, wherein the non-conductive substrate is aceramic substrate, and the conductive material is aluminum or titaniumsprayed on the ceramic substrate in accordance with a thermal sprayingprocess or a velocity spraying process.